COB Sensor Packaging (PLCC and CLCC)
Due to our COB (Chip On Board) process and the vertical integration of key components including VCM & lenses, we are able to offer production services for Sensor Packaging (PLCC, CLCC), as well as for complete module heads to sensor makers and camera module makers.
We also offer turn-key solutions including
- Optical Lens Design
- Circuit Design & Schematics Layout
- Mechanical Design
- Image Tuning Support
- CCM Test Specification Definition
Our manufacturing service is highly efficient in terms of cost and quality due to extra-high production yield rates we reach through the automated production and inspection line technology developed by Suyin.
Suyin supports a rapid time to market：
Sensor packaging and module heads: From design to mass production ramp-up: 2 months.
Camera devices including casing: From design, material preparation and outsourcing to mass production: 3 to 4 months.