SUYIN presents new DDR3 SO-DIMM and SDRAM sockets with 1.0mm contact pitch. SMT- und THT-versions allow broad application spectrum.
The new DDR3 memory modules with a capacity of 512MBit can transfer data at 8500MBit/s enabling higher speeds than DDR2. An additional benefit of DDR3 is the lower power consumption of only 1.5 volt making it ideal for mobile devices requiring long reliable battery times. SUYIN offers three versions of DDR3 sockets:
The SMT models 600018FB and 600015FB provide 204-pole SO-DIMM sockets in right-angled design. Their compact size make them ideal for Notebooks. The “reversed”-type 600015FB can be mounted on the bottom side of the PCB. Available socket housing heights are 4.0 mm, 8.0 mm and 9.2 mm. The “normal”-type 600018FB provides a housing height of 8.0 mm. Additional heights are currently in development. The final series will provide housing heights of 4.0 mm, 5.2 mm, 8.0 mm and 9.2 mm.
For desktop applications SUYIN offers the right-angled THT (Through Hole Technology) SDRAM socket 100039FS for vertical mounting. This type uses an ejector for fixing and releasing the memory modules. Typical applications are routers, telecommunication switches, servers and high-end workstations.
| contact resistance | max. 30 mΩ |
| insulation resistance | 1.000 MΩ |
| electric strength | 500 V AC for one minute |
| RoHS | lead-free and RoHS compliant |